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Fonekong, Mobile Repair Tools, Paste
Fonekong Solder Paste 183°
Fonekong Solder Paste 183° buy from www.gsm24seven.com.
Rs.299.00 Rs.399.00
Fonekong Solder Paste 183°
DESCRIPTION:
Temperature: 183℃ FONEKONG
It can be used for rework, sphere or pin attachment to BGA, PGA and CSP packages, and assemble operations such as Flip Chip attachment to PWB substrates. It is a necessary and helpful tool in BGA reballing.
Feature :
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Excellent capacity of solder-stickiness
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Excellent Anti-wet Capacity
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Widely used on BGA, PGA, CSP packages and flip chip operation
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Suitable for multiple PCB reflow
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No-clean and Lead free for environmental protection
| Weight | 0.100 kg |
|---|---|
| Dimensions | 8 × 5 × 5 cm |
| Weight | 0.040 kg |
|---|---|
| Color | As picture shown |
| Size | Approx. 1.30*1.30*1.14inch / 3.3*3.2*2.9cm |
| Type | XG50 |
| Alloy | Sn63/Pb37 |
| Microns | 25-45um |
| Material | Plastic +solder paste |
